Contractors will take on the Defense Department’s research needs for a planned national accelerator facility for chip research and development.
The Defense Advanced Research Projects Agency kicked off its search for vendors to take on the initial “Phase 0” research stage for the agency’s future manufacturing center, to be located in the US, for 3D heterogenously integrated (3DHI) circuit technology.
3DHI circuits are a type of microelectronic system that packs more transistors per device than older two-dimensional chips that aren’t vertically integrated. These ‘super chips’ boost the performance of a smaller device and could upend technology if DARPA is successful. …
