A new supply chain report posted in Taiwan today states that suppliers of SLP (substrate-like PCB) boards for the next-generation iPhone devices (tentatively named iPhone 12) have been ramping up shipments of related products since July-August, despite the fact that the new iPhones reportedly will debut later than normally scheduled, according to industry sources.
The new iPhone lineup may arrive in two stages, with two 6.1-inch models in the first and another two 6.7- and 5.4-inch devices in the second. The report noted that the production schedule began shipments of SLP mainboards for the 6.1-inch models in July followed by the mainboards for the iPhone 6.7- and 5.4-inch models in the second half of August.
Digitimes further noted that “Zhen Ding Technology and Austria’s AT&S reportedly are the major SLP suppliers in Apple’s iPhone 12 supply chain, with three more suppliers – US-based TTM Technologies and Taiwan’s Compeq Manufacturing and Unimicron Technology also being included but with fewer orders.”
